| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
13,908 pcs
|
13908 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
|
8,100 pcs
|
8100 pcs | On Request | 1 | On Request | On Request | 11+ | On Request | On Request | |
|
197 pcs
|
197 pcs | On Request | 1 | On Request | On Request | 13+ | On Request | On Request | |
|
85 pcs
|
85 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Capacity | |
| Halogen Free | |
| Memory Organization | |
| SVHC Present | |
| Storage Temperature |
The Samsung K4T1G164QF-BCE7 is a 1Gb DDR2 SDRAM memory chip designed for high-speed applications. It operates with a standard VDD of 1.8V ± 0.1V and VDDQ of 1.8V ± 0.1V.
This synchronous device achieves double-data-rate transfer rates of up to 800Mb/sec/pin (DDR2-800). Key features include 8 banks, programmable CAS Latency (3-6), programmable Additive Latency (0-5), and a write latency equal to read latency minus one. The burst length can be programmed for 4 or 8, with sequential or interleave burst mode.
Additional features include bi-directional differential data-strobe, Off-Chip Driver (OCD) impedance adjustment, and On Die Termination (ODT) at 50 ohms. The chip supports high-temperature self-refresh rate enable and has an average refresh period of 7.8us at lower than 85°C and 3.9us at 85°C.
The K4T1G164QF-BCE7 is organized as a 32Mbit x 4 I/Os x 8banks, 16Mbit x 8 I/Os x 8banks, or 8Mbit x 16 I/Os x 8 banks device. It comes in a BGA-84 package and is RoHS compliant.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.28 | $1.28 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The supply voltage is 1.8V nominal for both VDD and VDDQ.
It supports 333MHz for 667Mb/sec/pin and 400MHz for 800Mb/sec/pin data rates.
It has 8 banks.
Programmable CAS latency values of 3, 4, 5, and 6 are supported.
Burst lengths of 4 and 8 are available, with programmable sequential or interleave mode.
The memory capacity is 1Gb (Gigabit).
It is available in 84-ball BGA and 60FBGA/84FBGA packages.