| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
30,133 pcs
|
30133 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Lead Style | |
| SVHC Present |
The Samsung K4M56163LG-BN75 is an active memory component designed for integration into electronic devices and systems requiring reliable data storage solutions. This component features a BGA (Ball Grid Array) package, making it suitable for surface-mount applications.
Key specifications include its BGA package type and active product status. The component is RoHS3 compliant and has a Moisture Sensitivity Level (MSL) of 1, indicating unlimited usability under standard conditions. These attributes make it a suitable choice for various electronic designs.
Commonly used in computing, consumer electronics, and industrial applications, the K4M56163LG-BN75 is designed for environments where high-performance memory is essential. Its BGA packaging facilitates automated assembly processes.
This memory component is part of Samsung's offerings for reliable data storage. Its design considerations align with the needs of modern electronic systems requiring robust memory solutions.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.28 | $1.28 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The Samsung K4M56163LG-BN75 is an active memory component in BGA package format, designed for integration into electronic devices and systems requiring reliable data storage solutions. It's commonly used in computing, consumer electronics, and industrial applications where high-performance memory is essential.
The Samsung K4M56163LG-BN75 features a BGA (Ball Grid Array) package.
The K4M56163LG-BN75 is RoHS3 Compliant.
The Moisture Sensitivity Level (MSL) for the K4M56163LG-BN75 is 1 Unlimited.
The K4M56163LG-BN75 is REACH Unaffected.