K4FBE3D4HM-THCL The Samsung Electronics K4FBE3D4HM-THCL is a 32Gb LPDDR4 SDRAM. It features a 200-FBGA package with dimensions of 10x15mm.
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K4FBE3D4HM-THCL

Available from 1 distributors
Mfr Name: Samsung Electronics
Samsung Electronics
The Samsung Electronics K4FBE3D4HM-THCL is a 32Gb LPDDR4 SDRAM. It features a 200-FBGA package with dimensions of 10x15mm.
✓ Total Stock: 7,450 pcs

K4FBE3D4HM-THCL Available from 1 distributor

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✓ Non-Authorised
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7,450 pcs
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K4FBE3D4HM-THCL Specifications Quick View

Most important parameters for selection – full specs in datasheet.
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K4FBE3D4HM-THCL Description

Short technical summary and product information.

The Samsung Electronics K4FBE3D4HM-THCL is a high-density 32Gb LPDDR4 SDRAM. This component is designed for demanding applications requiring significant memory capacity and speed.

 

Key specifications include its LPDDR4 SDRAM memory type and a configuration of 64Mb x32DQ x8banks x2channels. The device is housed in a compact 200-FBGA package, measuring 10x15mm, making it suitable for space-constrained designs.

 

This memory component is part of Samsung's LPDDR4 offerings, providing efficient performance for various electronic systems. Its specifications suggest suitability for applications where high bandwidth and low power consumption are critical.

 

Further details regarding operating voltage, temperature, and specific interface protocols would typically be found in the manufacturer's datasheet. The provided information focuses on the core memory specifications and physical packaging.

K4FBE3D4HM-THCL Quick Information

Product Type: LPDDR4 SDRAM
Canonical Name: Samsung Electronics K4FBE3D4HM-THCL 32Gb LPDDR4 SDRAM
Subcategory: SDRAM

K4FBE3D4HM-THCL Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

K4FBE3D4HM-THCL Features

  • 32Gb LPDDR4 SDRAM memory density.
  • 200-FBGA package for compact PCB mounting.
  • 64Mb x32DQ x8banks x2channels configuration.
  • Low power LPDDR4 memory technology.
  • Samsung manufactured memory component.

K4FBE3D4HM-THCL Applications

  • Used in mobile device memory subsystems
  • Suitable for high-bandwidth computing applications
  • Designed for low-power portable electronics
  • Applied in dual-channel memory architectures

K4FBE3D4HM-THCL FAQs

6 frequently asked questions generated from this part’s specifications.
What type of memory is the K4FBE3D4HM-THCL?

The K4FBE3D4HM-THCL is an LPDDR4 SDRAM.

What is the density of the K4FBE3D4HM-THCL?

The density of the K4FBE3D4HM-THCL is 32Gb.

What is the package type for the K4FBE3D4HM-THCL?

The K4FBE3D4HM-THCL comes in a 200-FBGA package.

What are the package dimensions?

The package dimensions are 10x15mm.

What is the RoHS status of the K4FBE3D4HM-THCL?

The RoHS status is RoHS3 Compliant.

What is the Moisture Sensitivity Level (MSL) for this part?

The Moisture Sensitivity Level (MSL) is 1 Unlimited.

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