K4B2G1646F-BFMA The Samsung Electronics K4B2G1646F-BFMA is a memory module with an active status and BGA package.
Mfr Part #:

K4B2G1646F-BFMA

Available from 1 distributors
Mfr Name: Samsung Electronics
Samsung Electronics
The Samsung Electronics K4B2G1646F-BFMA is a memory module with an active status and BGA package.
✓ Total Stock: 20,953 pcs
$ Price Range: $1.50

K4B2G1646F-BFMA Available from 1 distributor

✓ Authorised
✓ Non-Authorised
Distributor Stock Pricing MOQ PKG Lead Time Date Code On Order Quantity On Order Delivery
Non-Authorised Inventory information
20,953 pcs
20953 pcs On Request 1 On Request On Request On Request On Request On Request

K4B2G1646F-BFMA Specifications Quick View

Most important parameters for selection – full specs in datasheet.
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Automotive Grade
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K4B2G1646F-BFMA Description

Short technical summary and product information.

The Samsung Electronics K4B2G1646F-BFMA is a memory module designed for various applications. It features an active status, indicating its readiness for use in electronic systems. The component is housed in a BGA (Ball Grid Array) package, which is suitable for surface-mount technology and offers good thermal performance.

 

This memory module is part of Samsung Electronics' product line, known for its reliability and performance in memory solutions. While specific operating voltage and temperature details are not provided here, the BGA packaging suggests it is intended for integration into compact and high-density electronic devices. Its active status makes it a direct-fit component for systems requiring immediate memory functionality.

K4B2G1646F-BFMA Quick Information

Product Type: Memory Module
Canonical Name: K4B2G1646F-BFMA Samsung Electronics
Subcategory: Memory Modules

K4B2G1646F-BFMA Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

K4B2G1646F-BFMA Estimated Pricing

Qty Low High
1+ $1.50 $1.50

Estimated market price range - modelled values for guidance only, not live distributor offers.

K4B2G1646F-BFMA Features

  • BGA package for compact design.
  • Active status indicates current availability.
  • Original Samsung module for reliability.
  • Memory module categorized under memory modules.
  • Designed for memory card applications.

K4B2G1646F-BFMA Applications

  • Suitable for high-density memory modules.
  • Used in electronic devices requiring BGA packaging.
  • Ideal for consumer electronics with Samsung memory.
  • Applicable in industrial memory applications.

K4B2G1646F-BFMA FAQs

5 frequently asked questions generated from this part’s specifications.
What is the status of the Samsung K4B2G1646F-BFMA?

The status is Active.

What type of package does the K4B2G1646F-BFMA use?

It uses a BGA package.

What is the RoHS status of the K4B2G1646F-BFMA?

It is RoHS3 Compliant.

What is the Moisture Sensitivity Level (MSL) for this part?

The MSL is 1 Unlimited.

What is the REACH status for the K4B2G1646F-BFMA?

It is REACH Unaffected.

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