K4B2G1646F The Samsung Electronics K4B2G1646F is a 2Gbit DDR3 SDRAM memory integrated circuit. It is organized as 128Mx16 and operates at a voltage of 1.5V.
Mfr Part #:

K4B2G1646F

Available from 1 distributors
Mfr Name: Samsung Electronics
Samsung Electronics
The Samsung Electronics K4B2G1646F is a 2Gbit DDR3 SDRAM memory integrated circuit. It is organized as 128Mx16 and operates at a voltage of 1.5V.
✓ Total Stock: 396 pcs
$ Price Range: $1.28

K4B2G1646F Available from 1 distributor

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✓ Non-Authorised
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396 pcs
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K4B2G1646F Specifications Quick View

Most important parameters for selection – full specs in datasheet.
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Manufacturer Name
Operating Voltage

K4B2G1646F Description

Short technical summary and product information.

The Samsung Electronics K4B2G1646F is a 2-gigabit (2Gb) Double Data Rate 3 (DDR3) Synchronous DRAM, belonging to the DDR3 F-die generation. This memory IC is manufactured by Samsung Semiconductor and is organized as 128M words by 16 bits (128M x 16), providing a total storage capacity of 256 megabytes.

 

Key technical specifications include a DRAM type of DDR3 SDRAM with a chip density of 2Gbit. It operates at a voltage of 1.5V. The component is housed in a 96-pin FBGA package.

 

This memory IC is suitable for various electronic applications requiring high-speed data storage and retrieval. Its DDR3 technology offers enhanced performance compared to previous generations.

K4B2G1646F Quick Information

Product Type: DRAM Chip
Series: F-die generation
Canonical Name: Samsung Electronics K4B2G1646F DDR3 SDRAM Memory IC
Subcategory: DRAM

K4B2G1646F Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

K4B2G1646F Estimated Pricing

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1+ $1.28 $1.28

Estimated market price range - modelled values for guidance only, not live distributor offers.

K4B2G1646F Features

  • 2Gbit DDR3 SDRAM memory IC.
  • Organized as 128Mx16 for 256MB capacity.
  • Operates at a 1.5V supply voltage.
  • Packaged in a 96-pin FBGA.
  • Belongs to the DDR3 F-die generation.

K4B2G1646F Applications

  • Suitable for high-speed data storage.
  • Used in memory expansion applications.
  • Ideal for embedded systems.
  • Leverages DDR3 technology for performance.

K4B2G1646F FAQs

7 frequently asked questions generated from this part’s specifications.
What type of memory is the K4B2G1646F?

It is DDR3 SDRAM.

What is the memory density of this IC?

2Gbit.

What is the memory organization?

128M×16.

What is the storage capacity?

256MB.

What is the operating voltage?

1.5V.

What package is this device available in?

FBGA (96-Pin).

What is the pin count?

96 pins.

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