AS4C64M16D3W-12BCN
Alliance
The Alliance AS4C64M16D3W-12BCN is a 1Gb DDR3 DRAM with a 64M x 16 organization. It operates at 1.5V and features an 800MHz clock speed.
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12,053 pcs
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12053 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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| SVHC Present |
The Samsung Electronics K4B2G1646B-HCH9 is an embedded Multi-Chip Package (eMCP) designed for high-density storage and memory solutions. This component integrates 16GB of eMMC storage with 3GB of LPDDR3 RAM, providing a robust solution for embedded systems and mobile devices.
The eMCP is housed in a compact FBGA-221 package, making it suitable for space-constrained applications. Its architecture allows for efficient data handling and processing, crucial for modern electronic devices. The combination of storage and RAM on a single chip simplifies board design and reduces system complexity.
While specific operating voltage and temperature ranges are not detailed here, this eMCP is a key component in applications requiring significant on-device storage and fast memory access. Its design caters to the demands of performance-intensive embedded applications.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.28 | $1.28 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The Samsung K4B2G1646B-HCH9 eMCP has a storage capacity of 16GB.
The K4B2G1646B-HCH9 features 3GB of LPDDR3 RAM.
The Samsung K4B2G1646B-HCH9 eMCP is supplied in an FBGA-221 package.
The RoHS status is RoHS3 Compliant.
The Moisture Sensitivity Level (MSL) is 1 Unlimited.
The REACH status is REACH Unaffected.
