| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
396 pcs
|
396 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| SVHC Present |
The Samsung Electronics K4B2G1646B is an embedded Multi-Chip Package (eMCP) designed for high-density storage and memory solutions. It integrates 16GB of eMMC storage with 3GB of LPDDR3 RAM, providing a robust solution for embedded systems and mobile devices.
The component is housed in a compact FBGA-221 package, facilitating integration into space-constrained designs. Its architecture is optimized for performance and efficiency, making it suitable for a wide range of applications requiring integrated storage and memory.
While still relevant for cost-sensitive legacy systems, the market is shifting towards newer technologies. However, the K4B2G1646B remains a viable option for applications where its specifications meet the required performance and cost targets.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.28 | $1.28 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The Samsung K4B2G1646B eMCP has a storage capacity of 16GB.
The Samsung K4B2G1646B eMCP has a RAM capacity of 3GB.
The Samsung K4B2G1646B eMCP uses LPDDR3 RAM.
The Samsung K4B2G1646B eMCP is supplied in an FBGA-221 package.