| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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6,750 pcs
|
6750 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The Samsung Electronics K3UH7H70AM-AGCL is a high-performance LPDDR4X memory module designed for demanding applications. It offers a substantial density of 64 Gb and operates at a rapid speed of 4266 Mbps, ensuring efficient data transfer.
This memory component is suitable for a wide range of operating conditions, with an operating temperature range of -25 to 85 °C. The package type is 556FBGA, which is commonly used in modern electronic devices for its compact size and reliable connectivity.
Key electrical specifications include a density of 64 Gb and an organization of x64. The operating voltage is specified as 1.8 / 1.1 / 0.6 V, providing flexibility for different power requirements. The part is manufactured by Samsung Electronics, a leader in semiconductor technology.
This component is part of the DRAM family and falls under the LPDDR4X subcategory. Its robust specifications make it suitable for applications requiring high memory bandwidth and capacity.
The memory type is LPDDR4X.
The density is 64 Gb.
The operating speed is 4266 Mbps.
The operating voltage is 1.8 / 1.1 / 0.6 V.
The operating temperature range is -25 to 85 °C.
It uses the 556FBGA package.