SAA7119E/V2/G
NXP Semiconductors
The NXP Semiconductors SAA7119E/V2/G is an Encoder/Decoder IC in a BGA package. It is RoHS3 Compliant.
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1,859 pcs
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1859 pcs | On Request | 1 | On Request | On Request | 1001+ | On Request | On Request | |
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295 pcs
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295 pcs | On Request | 1 | On Request | On Request | 1001+ | On Request | On Request |
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The JMC251-LGAZ0A from Micron Technology is a chipset designed for various electronic applications. It features a BGA package, requiring specific handling precautions due to its moisture sensitivity.
This component adheres to RoHS3 compliance standards, indicating it is free from hazardous substances. It also has a Moisture Sensitivity Level (MSL) of 1, meaning it has unlimited shelf life under recommended storage conditions. The REACH status is unaffected, suggesting compliance with relevant chemical regulations.
Handling precautions for BGA chips include baking before mounting to prevent moisture-related issues. The recommended baking process involves 125℃±5℃ for 24 hours or 80℃±5℃ for 48 hours. For lead-free balls, soldering temperatures should not exceed 245℃-260℃, while for leaded balls, it's 180℃-205℃.
This chipset is suitable for applications where reliable performance and compliance with environmental standards are critical.
The JMC251-LGAZ0A is RoHS3 Compliant.
The JMC251-LGAZ0A has an MSL rating of 1.
The JMC251-LGAZ0A requires baking at 125℃±5℃ for 24 hours or 80℃±5℃ for 48 hours before mounting.
For lead-free balls, the maximum soldering temperature is 260℃. For leaded balls, it is 205℃.