| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
6,750 pcs
|
6750 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
|
6,532 pcs
|
6532 pcs | On Request | 1 | On Request | On Request | 17+ | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Access Time | |
| Clock Frequency | |
| Memory Format | |
| Memory Interface | |
| Memory Organization | |
| Memory Size | |
| Memory Type | |
| Mounting Type | |
| Operating Temperature | |
| Supplier Device Package | |
| Technology | |
| Voltage |
The Integrated Silicon Solution IS45S16160J-6TLA1 is a 256Mbit Synchronous DRAM (SDRAM) designed for high-speed data transfer. It utilizes a pipeline architecture and operates with all input and output signals referenced to the rising edge of the clock input.
Key electrical specifications include a maximum clock frequency of 166 MHz (with CAS Latency = 3) and a maximum access time from clock of 5.4 ns. The device operates from a single 3.3V power supply with LVTTL interface. It supports programmable burst lengths and sequences, Auto Refresh (CBR), and Self Refresh capabilities. The memory organization is 16M x 16.
This SDRAM is available in a 54-TSOP II package, suitable for surface mount applications. The operating temperature range is -40°C to 85°C. It is organized with 4 banks for efficient row access and precharge operations.
Refresh cycles are managed with 8K refresh cycles every 32 ms for A2 grade or 64 ms for commercial, industrial, and A1 grades. The device supports burst read/write and burst read/single write operations, with burst termination controlled by burst stop and precharge commands.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.28 | $1.28 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The memory size is 256 Mbit.
The operating voltage is 3.3V.
The maximum clock frequency at CAS latency 3 is 166 MHz.
The operating temperature range is -40°C to 85°C.
It is available in a 54-TSOP II package for surface mount.
The memory organization is 16M x 16.
The access time from clock at CAS latency 3 is 5.4 ns.