| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
4,000 pcs
|
4000 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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| Manufacturer Name | |
| Current | |
| Drain to Source Voltage (Vdss) | |
| Drive Voltage (Max Rds On, Min Rds On) | |
| FET Type | |
| Gate Charge (Qg) (Max) @ Vgs | |
| Halogen Free | |
| Mounting Type | |
| Operating Temperature | |
| Power Dissipation (Max) | |
| Rds On (Max) @ Id, Vgs | |
| Storage Temperature | |
| Supplier Device Package | |
| Supplier Package | |
| Technology | |
| Vgs (Max) | |
| Vgs(th) (Max) @ Id |
The IRF7807 is an N-Channel MOSFET from Infineon Technologies, part of the HEXFET chip-set designed for DC-DC converters. It offers low conduction and switching losses, making it ideal for high-efficiency power conversion in mobile applications.
Key specifications include a maximum drain-source voltage of 30V, continuous drain current of 8.3A at 25°C, and a low on-resistance of 25mΩ at Vgs=4.5V and Id=7A. The total gate charge is 17nC, enabling fast switching with typical turn-on delay of 12ns, rise time of 17ns, turn-off delay of 25ns, and fall time of 6ns.
The device is housed in an 8-SOIC surface mount package with a junction-to-ambient thermal resistance of 50°C/W. Operating junction temperature ranges from -55°C to 150°C. The IRF7807 is lead-free and RoHS compliant as verified by the datasheet.
Typical applications include mobile DC-DC converters operating at 3.3V and 5V system voltages, and power management for microprocessors.
| Qty | Low | High |
|---|---|---|
| 95+ | $0.82 | $0.82 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
30V maximum.
8-SOIC (0.154", 3.90mm Width) surface mount package.
-55°C to 150°C junction temperature.
Yes, the datasheet indicates lead-free and RoHS compliant.
25mΩ maximum at Vgs=4.5V, Id=7A.
17nC total gate charge at Vgs=5V.
8.3A at 25°C ambient temperature.