SL3S1206FUD2/HAA-VB2
NXP Semiconductors
The NXP Semiconductors SL3S1206FUD2/HAA-VB2 is a Chassis Mount Resistor. It is RoHS3 Compliant and REACH Unaffected.
| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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7,047 pcs
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7047 pcs | On Request | 1 | On Request | On Request | 0738+ | On Request | On Request |
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| Tape & Reel |
The HYB18TC512160BF-3S is a memory module produced by Qimonda, designed for use in integrated circuit applications. It is packaged as a Ball Grid Array (BGA) and is classified within the memory category of electronic components. The module complies with RoHS3 standards, indicating it is free from certain hazardous substances, and has a Moisture Sensitivity Level (MSL) of 1, suitable for handling and storage in various environments. The product is REACH unaffected, ensuring compliance with European chemical safety regulations.
This memory component is suitable for applications requiring reliable data storage, such as in computing, embedded systems, and communication devices. Its BGA package allows for compact mounting on printed circuit boards, supporting high-density designs. The absence of specific electrical parameters in the available data suggests that detailed electrical characteristics should be obtained from the datasheet or manufacturer for precise integration into electronic systems.
| Qty | Low | High |
|---|---|---|
| 1+ | $10.03 | $10.03 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The module is RoHS3 compliant.
The MSL is 1, unlimited.
Yes, it is REACH unaffected.
