| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
3,507 pcs
|
3507 pcs | On Request | 1 | On Request | On Request | 0850+ | On Request | On Request |
| Category | |
| Manufacturer Name | |
| AEC Qualified | |
| Automotive Grade | |
| Industrial Grade | |
| Medical Grade | |
| Military Grade | |
| Storage Temperature | |
| Tape & Reel |
The HYB18TC512160B2F-3S from Qimonda is a memory module designed for various electronic applications. This component is housed in a BGA1515 package, suitable for surface-mount designs.
Key specifications include RoHS3 Compliance and a Moisture Sensitivity Level (MSL) of 1 Unlimited, indicating it is not sensitive to moisture and requires no special handling precautions beyond standard ESD practices. The packaging options include Tape & Reel (TR), Cut Tape (CT), Tray, and Tube, offering flexibility for different manufacturing processes.
This memory module is part of Qimonda's product line, known for its contributions to memory technology. While specific electrical characteristics like operating voltage and speed are not detailed here, the provided compliance and packaging information is crucial for integration into system designs.
| Qty | Low | High |
|---|---|---|
| 1+ | $20.68 | $20.68 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The HYB18TC512160B2F-3S is supplied in a BGA1515 package.
The HYB18TC512160B2F-3S is Lead free / RoHS Compliant.
The Moisture Sensitivity Level (MSL) is 1 Unlimited.
The HYB18TC512160B2F-3S is available in Tape & Reel (TR), Cut Tape (CT), Tray, and Tube packaging.