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HSB28-606022 HEAT SINK, BGA, 60 X 60 X 22 MM,
Mfr Part #:

HSB28-606022

Mfr Name: CUI Devices
CUI Devices
Description:
HEAT SINK, BGA, 60 X 60 X 22 MM,
Stock on Request

HSB28-606022 Specifications Quick View

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HSB28-606022 Description

Short technical summary and product information.
HEAT SINK, BGA, 60 X 60 X 22 MM,

HSB28-606022 Quick Information

Mfr Standard Lead Time: 12 weeks (varies by distributor)
RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected
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