Mfr Part #:

HSB23-232325

Name: HSB23-232325
Brand: CUI Devices
SKU: HSB23-232325

Mfr Name: CUI Devices

Description:

HEAT SINK, BGA, 23 X 23 X 25 MM

Stock on Request

HSB23-232325 Description

Short technical summary and product information.

HEAT SINK, BGA, 23 X 23 X 25 MM

Mfr Standard Lead Time: 12 weeks (varies by distributor)

RoHS Status: RoHS Compliant

Moisture Sensitivity Level (MSL): 1 Unlimited

REACH Status: REACH Unaffected

Category	Heat Sinks
Manufacturer Name	CUI Devices
Attachment Method	Adhesive
Fin Height	0.984" (25.00mm)
Length	0.906" (23.00mm)
Material	Aluminum Alloy
Material Finish	Black Anodized
Package Cooled	BGA
Power Dissipation @ Temperature Rise	6.13W @ 75°C
Shape	Square, Pin Fins
Thermal Resistance @ Forced Air Flow	3.80°C/W @ 200 LFM
Thermal Resistance @ Natural	12.23°C/W
Type	Top Mount
Width	0.906" (23.00mm)