Mfr Part #:

HSB22-606010

Name: HSB22-606010
Brand: CUI Devices
SKU: HSB22-606010

Mfr Name: CUI Devices

Description:

HEAT SINK, BGA, 60 X 60 X 10 MM

Stock on Request

HSB22-606010 Description

Short technical summary and product information.

HEAT SINK, BGA, 60 X 60 X 10 MM

Mfr Standard Lead Time: 12 weeks (varies by distributor)

RoHS Status: RoHS Compliant

Moisture Sensitivity Level (MSL): 1 Unlimited

REACH Status: REACH Unaffected

Category	Heat Sinks
Manufacturer Name	CUI Devices
Attachment Method	Adhesive
Fin Height	0.394" (10.00mm)
Length	2.362" (60.00mm)
Material	Aluminum
Material Finish	Black Anodized
Package Cooled	BGA
Power Dissipation @ Temperature Rise	9.8W @ 75°C
Shape	Square, Pin Fins
Thermal Resistance @ Forced Air Flow	2.60°C/W @ 200 LFM
Thermal Resistance @ Natural	7.62°C/W
Type	Top Mount
Width	2.362" (60.00mm)