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HSB22-606010 HEAT SINK, BGA, 60 X 60 X 10 MM
Mfr Part #:

HSB22-606010

Mfr Name: CUI Devices
CUI Devices
HEAT SINK, BGA, 60 X 60 X 10 MM
Stock on Request

HSB22-606010 Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Attachment Method
Fin Height
Length
Material
Material Finish
Package Cooled
Power Dissipation @ Temperature Rise
Shape
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Type
Width
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HSB22-606010 Description

Short technical summary and product information.
HEAT SINK, BGA, 60 X 60 X 10 MM

HSB22-606010 Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected
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