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| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
163 pcs
|
163 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Connector Type | |
| Contact Finish | |
| Contact Finish Thickness | |
| Contact Material | |
| Contact Plating Underplating | |
| Contact Type | |
| Current Rating (Amps) | |
| Fastening Type | |
| Features | |
| Insertion Depth | |
| Insulation Color | |
| Insulation Height | |
| Insulator Material | |
| Lead-Free Solderable | |
| Mounting Type | |
| Number of Positions | |
| Number of Positions Loaded | |
| Number of Rows | |
| Operating Temperature | |
| Packaging Option | |
| Packaging Type | |
| Pitch | |
| Row Spacing | |
| SMT Lead Coplanarity | |
| Style | |
| Tape & Reel | |
| Termination | |
| Voltage Rating |
The Samtec HLE-108-02-G-DV-P-TR is a 16 position, 2 row, 2.54mm pitch surface mount receptacle from the HLE series. It features a black liquid crystal polymer insulator and beryllium copper contacts with gold plating over 50 µ" nickel underplating. The connector is rated for 4.1A per contact and 400VAC, with an operating temperature range of -55°C to +125°C.
This board-to-board receptacle uses a push-pull fastening type and is designed for surface mount soldering termination. It includes a metal pick and place pad for automated assembly. The contact finish thickness is 20.0 µ" (0.51 µm) gold. The insulation height is 3.66mm.
The connector is lead-free solderable and available in tape and reel packaging. It mates with Samtec TSW, MTSW, DW, EW, ZW, TLW, TSM, MTLW, and HW series headers.
| Qty | Low | High |
|---|---|---|
| 700+ | $2.98 | $2.98 |
| 1,400+ | $2.79 | $2.79 |
| 2,100+ | $2.67 | $2.67 |
| 4,900+ | $2.19 | $2.19 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
16 positions arranged in 2 rows.
2.54mm (0.100").
4.1A per contact.
400VAC.
Surface mount.
-55°C to +125°C.
Beryllium copper with 20 µ" (0.51 µm) gold plating over 50 µ" (1.27 µm) nickel.