| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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200 pcs
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200 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The 3M HDC-R128-41P1-TG30 is a high-density receptacle connector designed for backplane and parallel PCB stacking applications. It features 128 positions arranged in 4 rows with a 0.100" (2.54mm) pitch, providing a compact interconnection solution.
The connector uses through hole press-fit termination, offering a reliable solderless connection that simplifies assembly. Contacts are made of copper alloy with a gold finish (30.0μin / 0.76μm) over nickel underplating for excellent conductivity and corrosion resistance. The housing is molded from glass filled thermoplastic (LCP) with a UL 94V-0 flammability rating and black color.
Electrical ratings include 3.0 A per contact, 900 VAC withstanding voltage for 1 minute, and 1000 MΩ minimum insulation resistance at 500 VDC. The operating temperature range is -55°C to +105°C, and the connector is rated for 260°C peak process temperature per J-STD-020C. Moisture Sensitivity Level is 1 (unlimited).
This connector is RoHS compliant and suitable for high-density interconnection in telecommunications, data communication, industrial control, and computer systems.
| Qty | Low | High |
|---|---|---|
| 450+ | $28.58 | $28.58 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
128 positions, all loaded.
2.54mm (0.100").
3.0 A.
900 VAC for 1 minute.
Through hole with press-fit termination.
-55°C to +105°C.
Gold, 30.0μin (0.76μm) over nickel underplating.