| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
6,500 pcs
|
6500 pcs | On Request | 1 | On Request | On Request | 22+ | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Memory Type | |
| Mounting Type | |
| SVHC Present |
This SK HYNIX H9TQ64A8GTCCUR-KUM is an embedded Multi-Chip Package (eMCP) memory solution. It combines 8GB of eMMC 5.1 storage with 8Gb of LPDDR3-1866 RAM, providing a total memory capacity of 16GB.
The component is housed in a 221-FBGA package, designed for surface mount applications. This integrated approach is suitable for devices requiring compact and high-performance memory solutions.
Key specifications include an eMMC version of 5.1 and an LPDDR3 speed of 1866 MT/s. The RoHS status is reported as RoHS3 Compliant, and the Moisture Sensitivity Level (MSL) is 1 Unlimited.
| Qty | Low | High |
|---|---|---|
| 1+ | $8.57 | $8.57 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The H9TQ64A8GTCCUR-KUM has a total memory capacity of 16GB, combining 8GB of eMMC 5.1 and 8Gb of LPDDR3-1866.
This component supports eMMC version 5.1.
The LPDDR3 speed is 1866 MT/s.
It is an eMCP (embedded Multi-Chip Package) memory.
The package type is 221-FBGA.
The RoHS status is RoHS3 Compliant.
The Moisture Sensitivity Level (MSL) is 1 Unlimited.