| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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297 pcs
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297 pcs | On Request | 1 | On Request | On Request | 16+15+ | On Request | On Request |
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The SK HYNIX H9TQ17ABJTMCUR-KUM is a combined eNAND flash and LPDDR3 RAM memory solution, categorized as a CI-MCP (Chip-on-Chip) package. This component integrates 16GB of eNAND (x8) flash memory with 16Gb (x32) of LPDDR3 memory.
This product is designed for applications requiring high-density storage and fast memory access. The combination of eNAND and LPDDR3 in a single package offers advantages in terms of space saving and performance for embedded systems.
Key specifications include 16GB eNAND (x8) and 16Gb LPDDR3 (x32) memory. The component is described as RoHS3 Compliant, with an MSL rating of 1 Unlimited and REACH Unaffected status. Further details regarding operating voltage, temperature, and specific package dimensions would typically be found in the manufacturer's datasheet.
This memory solution is suitable for various electronic devices and systems where integrated, high-performance storage and memory are critical. The CI-MCP package type suggests a compact form factor, beneficial for space-constrained designs.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.28 | $1.28 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The H9TQ17ABJTMCUR-KUM is a CI-MCP memory component that combines 16GB of eNAND flash memory with 16Gb of LPDDR3 RAM.
This component features 16GB of eNAND (x8) flash memory and 16Gb of LPDDR3 (x32) memory.
The RoHS status is RoHS3 Compliant.
The Moisture Sensitivity Level (MSL) is 1 Unlimited.