| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
10,000 pcs
|
10000 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Density | |
| Memory Type | |
| SVHC Present |
The SK Hynix H9HCNNN8KUMLHR-NLN is a high-performance memory component belonging to the LPDDR4 family, operating at a speed of 3200 MT/s. This specific part offers a substantial 8Gb density, making it suitable for applications requiring significant data storage and rapid access.
The component is housed in a DDP (Dual-Die Package) which can offer advantages in terms of form factor and performance. The package type is further specified as FBGA200, indicating a Ball Grid Array form factor with 200 balls. The RoHS status is reported as RoHS3 Compliant, and the Moisture Sensitivity Level (MSL) is 1, signifying unlimited shelf life under standard conditions.
This memory module is designed for integration into various electronic systems where speed and capacity are paramount. Its specifications suggest suitability for consumer electronics, mobile devices, and embedded systems that demand efficient memory solutions.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.28 | $1.28 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The memory type is LPDDR4-3200.
The density is 8Gb.
It uses a DDP package.
The package / case is FBGA200.
Yes, it is RoHS3 Compliant.
The MSL is 1 Unlimited.
No, it is REACH Unaffected.