| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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12,053 pcs
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12053 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The SK HYNIX H8ACU0CE0BBR-36M-C is a memory chip designed for various electronic applications. This component adheres to RoHS3 compliance standards, indicating a commitment to environmental regulations. It also features a Moisture Sensitivity Level (MSL) of 1 Unlimited, which is crucial for handling and storage to prevent moisture-related damage.
The memory chip is housed in a Ball Grid Array (BGA) package, a common form factor for surface-mount components that offers good thermal performance and high pin density. The BGA package is suitable for automated assembly processes and provides a reliable connection to the printed circuit board.
This part is manufactured by SK HYNIX, a recognized leader in memory technology. While specific electrical characteristics like memory type, data rate, and voltage are not detailed here, the available compliance and packaging information provides a foundation for design considerations. Further details would typically be found in the manufacturer's datasheet.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.28 | $1.28 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The H8ACU0CE0BBR-36M-C is RoHS3 Compliant.
The Moisture Sensitivity Level (MSL) is 1 Unlimited.
Yes, the REACH status is REACH Unaffected.
The H8ACU0CE0BBR-36M-C uses a BGA package.