| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
6,253 pcs
|
6253 pcs | On Request | 1 | On Request | On Request | 09+ | On Request | On Request |
| Category | |
| Manufacturer Name |
The H8ACSOPGOMBP-56M from SK Hynix is a memory component designed for various electronic applications. This part is specified as RoHS3 Compliant and has a Moisture Sensitivity Level (MSL) of 1 Unlimited, indicating it is suitable for standard handling procedures. The component is supplied in a BGA (Ball Grid Array) package, which is commonly used for surface-mount devices requiring high pin density and good thermal performance.
While specific electrical characteristics such as operating voltage, current, and frequency are not detailed in the provided information, the component's classification as 'Memory' suggests its role in data storage or processing within a larger system. The BGA packaging implies a surface-mount design, requiring appropriate soldering techniques for integration onto a printed circuit board.
This component is available through distributors like SeekIC.com, with pricing varying based on quantity. The date code is listed as 11+, suggesting production from 2011 onwards. Further technical details would typically be found in the manufacturer's datasheet.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.87 | $1.87 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The H8ACSOPGOMBP-56M is RoHS3 Compliant.
The MSL for the H8ACSOPGOMBP-56M is Level 1 Unlimited.
The H8ACSOPGOMBP-56M is supplied in a BGA package.