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H5MS1G22MFP-J3M-C The SK HYNIX H5MS1G22MFP-J3M-C is a Memory IC. It features RoHS3 compliance and is packaged in FBGA.
Mfr Part #:

H5MS1G22MFP-J3M-C

Available from 1 distributors
Mfr Name: SK Hynix
SK Hynix
The SK HYNIX H5MS1G22MFP-J3M-C is a Memory IC. It features RoHS3 compliance and is packaged in FBGA.
✓ Total Stock: 9,040 pcs
$ Price Range: $1.28

H5MS1G22MFP-J3M-C Available from 1 distributor

✓ Authorised
✓ Non-Authorised
Distributor Stock Pricing MOQ PKG Lead Time Date Code On Order Quantity On Order Delivery
Romaks Technologies ✓
Non-Authorised Inventory information
9,040 pcs
On Request
9040 pcs On Request 1 On Request On Request On Request On Request On Request
DistyParts aggregates offers from multiple distributors. Final prices, lead times and terms are subject to the distributors' discretion and may change without prior notice. DistyParts is not liable for any discrepancies.

H5MS1G22MFP-J3M-C Specifications Quick View

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H5MS1G22MFP-J3M-C Description

Short technical summary and product information.

The SK HYNIX H5MS1G22MFP-J3M-C is a Memory Integrated Circuit. This component is RoHS3 Compliant, indicating adherence to restrictions on hazardous substances. It has a Moisture Sensitivity Level (MSL) of 1, meaning it has unlimited shelf life under recommended storage conditions. The REACH status is unaffected, suggesting compliance with regulations concerning chemical substances. The component is supplied in an FBGA package.

 

This memory IC is suitable for various electronic applications requiring reliable memory storage. Its specifications suggest it is designed for performance and ease of integration into modern electronic systems. The FBGA packaging is common for high-density semiconductor devices, facilitating efficient board space utilization.

H5MS1G22MFP-J3M-C Quick Information

Product Type: Memory IC
Canonical Name: SK HYNIX H5MS1G22MFP-J3M-C Memory IC
Subcategory: Memory

H5MS1G22MFP-J3M-C Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

H5MS1G22MFP-J3M-C Estimated Pricing

Qty Low High
1+ $1.28 $1.28

Estimated market price range - modelled values for guidance only, not live distributor offers.

H5MS1G22MFP-J3M-C Features

  • FBGA package for compact PCB design.
  • RoHS3 Compliant for environmental compliance.
  • REACH Unaffected status.
  • MSL 1 - no moisture sensitivity restrictions.
  • Memory IC from SK Hynix.

H5MS1G22MFP-J3M-C Applications

  • Designed for high-speed memory modules.
  • Suitable for embedded system applications.
  • Ideal for networking and telecom equipment.
  • Used in industrial control and automation systems.

H5MS1G22MFP-J3M-C FAQs

4 frequently asked questions generated from this part’s specifications.
What is the RoHS status of the H5MS1G22MFP-J3M-C?

The H5MS1G22MFP-J3M-C is RoHS3 Compliant.

What is the Moisture Sensitivity Level (MSL) for this part?

The MSL for the H5MS1G22MFP-J3M-C is 1 Unlimited.

What is the REACH status of the H5MS1G22MFP-J3M-C?

The REACH status is Unaffected.

What type of package is the H5MS1G22MFP-J3M-C supplied in?

The H5MS1G22MFP-J3M-C is supplied in an FBGA package.

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