| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
1,000 pcs
|
1000 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Connector Type | |
| Contact Finish | |
| Contact Finish Thickness | |
| Features | |
| Height Above Board | |
| Lead Spacing | |
| Mated Stacking Heights | |
| Mounting Type | |
| Number of Positions | |
| Number of Rows | |
| Pitch | |
| Tape & Reel | |
| Termination Style |
The FX11A-80P/8-SV(91) is a 80-position header outer shroud contacts connector designed for board-to-board mezzanine stacking. It features a 0.5mm pitch and 2 rows, providing a compact high-density interconnect solution.
The connector is surface mount with solder termination and gold contact finish (4.00µin thickness). It includes a board guide, ground plate, and solder retention features for reliable assembly and EMI performance. The mated stacking height is 2.5mm, and the height above board is 0.084 inches (2.13mm).
This connector is suitable for applications requiring dense board-to-board connections in compact electronic devices. The ground plate aids in reducing electromagnetic interference. The gold plating ensures reliable signal integrity over repeated mating cycles.
| Qty | Low | High |
|---|---|---|
| 1,000+ | $3.44 | $3.44 |
| 2,000+ | $3.41 | $3.41 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
It has 80 positions arranged in 2 rows.
The pitch is 0.50mm (0.020 inches).
The connector is surface mount with solder termination.
Gold contact finish with a thickness of 4.00µin (0.100µm).
The mated stacking height is 2.5mm.
It includes a board guide, ground plate, and solder retention.