| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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660 pcs
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660 pcs | On Request | 1 | On Request | On Request | 19+ | On Request | On Request | |
|
360 pcs
|
360 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The FSBS10CH60T is a three-phase IGBT power driver module from onsemi, part of the Smart Power Module (SPM) series in the SPM27-B package. It integrates IGBT technology in a 27-pin PowerDIP module with through-hole mounting.
The module supports a 10A collector current and provides 2500Vrms isolation voltage. Its three-phase configuration makes it suitable for power stages requiring multiple phases in a single package.
Designed as a power driver module, this component is commonly used in power switching circuits and three-phase applications such as inverters and motor drives. The through-hole package facilitates robust mechanical mounting on printed circuit boards.
Housed in a 27-PowerDIP Module (1.205", 30.60mm), the FSBS10CH60T is offered for through-hole assembly, which is well-suited for prototypes and production environments where high mechanical strength is required.
27-PowerDIP Module (1.205", 30.60mm).
It is listed as RoHS3 Compliant (unverified).
10A.
Through hole.
2500Vrms.
3 phase.
IGBT.