| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
3,000 pcs
|
3000 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Current | |
| Drain to Source Voltage (Vdss) | |
| Drive Voltage (Max Rds On, Min Rds On) | |
| FET Type | |
| Gate Charge (Qg) (Max) @ Vgs | |
| Input Capacitance (Ciss) (Max) @ Vds | |
| Mounting Type | |
| Operating Temperature | |
| Power Dissipation (Max) | |
| Rds On (Max) @ Id, Vgs | |
| Supplier Device Package | |
| Technology | |
| Vgs (Max) | |
| Vgs(th) (Max) @ Id |
The FQI4N80TU is an N-channel power MOSFET manufactured by onsemi. It uses metal-oxide semiconductor technology and is designed for high-voltage switching operations. Key electrical specifications include an 800V drain-to-source voltage (Vdss), 3.9A continuous drain current (Tc), and a maximum on-resistance of 3.6Ω at Vgs=10V and Id=1.95A.
Gate drive requirements include a maximum gate threshold voltage of 5V at 250µA, and a recommended drive voltage of 10V. The device can handle a maximum gate-source voltage of ±30V. The maximum gate charge is 25nC at Vgs=10V and maximum input capacitance is 880pF at Vds=25V.
Power dissipation is rated at 130W at case temperature and 3.13W at ambient temperature. The junction operating temperature ranges from -55°C to 150°C. Thermal design should account for these limits.
The FQI4N80TU is supplied in a TO-262-3 long leads (I²Pak / TO-262AA) package with through-hole mounting. This package is suitable for high-power PCB designs where thermal and mechanical robustness are required.
800V.
3.9A at case temperature Tc.
3.6Ω maximum at Id=1.95A and Vgs=10V.
-55°C to 150°C junction temperature.
TO-262-3 long leads (I²Pak / TO-262AA), through-hole mounting.
Data indicates RoHS3 compliant, but this status is unverified.
25nC maximum at Vgs=10V.