| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
517 pcs
|
517 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Current | |
| Drain to Source Voltage (Vdss) | |
| Drive Voltage (Max Rds On, Min Rds On) | |
| FET Type | |
| Gate Charge (Qg) (Max) @ Vgs | |
| Input Capacitance (Ciss) (Max) @ Vds | |
| Mounting Type | |
| Operating Temperature | |
| Power Dissipation (Max) | |
| Rds On (Max) @ Id, Vgs | |
| SVHC Present | |
| Supplier Device Package | |
| Technology | |
| Vgs (Max) | |
| Vgs(th) (Max) @ Id |
The FQB8P10TM is a P-Channel enhancement-mode power MOSFET manufactured by On Semiconductor. It is designed for high-efficiency power management applications requiring a P-Channel switch. The device offers a drain-to-source voltage (Vdss) of 100V and a continuous drain current (Id) of 8A at case temperature (Tc).
Key electrical characteristics include a maximum on-resistance (Rds on) of 530mOhm at a gate drive of 10V and 4A drain current. The gate threshold voltage (Vgs(th)) is a maximum of 4V at 250µA drain current. The device has a total gate charge (Qg) of 15nC at 10V and an input capacitance (Ciss) of 470pF at 25V drain-source voltage. Maximum power dissipation is 65W at case temperature and 3.75W at ambient temperature.
The FQB8P10TM is housed in a TO-263-3 (D2PAK) surface mount package, which is suitable for automated assembly processes. The operating junction temperature range is -55°C to 175°C.
The drain-source breakdown voltage (Vdss) is 100V.
The continuous drain current (Id) is 8A at case temperature (Tc).
The maximum on-resistance (Rds on) is 530mOhm at a gate-source voltage of 10V and drain current of 4A.
The operating junction temperature range is -55°C to 175°C.
The FQB8P10TM is available in a TO-263-3 (D2PAK) surface mount package.
The maximum gate threshold voltage (Vgs(th)) is 4V at a drain current of 250µA.
The maximum power dissipation is 65W at case temperature (Tc) and 3.75W at ambient temperature (Ta).