FNB33060T The FNB33060T is a 600V, 30A 3-phase IGBT inverter module from On Semiconductor. It integrates gate drivers, protection features, and is housed in a through-hole 27-PowerDIP package.
Mfr Part #:

FNB33060T

Available from 2 distributors
Mfr Name: On Semiconductor
On Semiconductor
The FNB33060T is a 600V, 30A 3-phase IGBT inverter module from On Semiconductor. It integrates gate drivers, protection features, and is housed in a through-hole 27-PowerDIP package.
✓ Total Stock: 1,666 pcs
$ Price Range: $18.65 - $25.67

FNB33060T Available from 2 distributors

✓ Authorised
✓ Non-Authorised
Distributor Stock Pricing MOQ PKG Lead Time Date Code On Order Quantity On Order Delivery
Non-Authorised Inventory information
1,623 pcs
1623 pcs On Request 1 On Request On Request On Request On Request On Request
Non-Authorised Inventory information
43 pcs
43 pcs On Request 1 On Request On Request On Request On Request On Request

FNB33060T Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Configuration
Current
Halogen Free
Mounting Type
Storage Temperature
Substrate
Tape & Reel
Type
Voltage

FNB33060T Description

Short technical summary and product information.

The FNB33060T is an advanced Motion SPM 3 module from On Semiconductor, providing a fully-featured, high-performance inverter output stage for AC Induction, BLDC, and PMSM motors. It integrates optimized gate drive of the built-in IGBTs to minimize EMI and losses.

 

Key specifications include a 600V IGBT voltage rating, 30A current rating, and 2500 Vrms isolation rating. The module features a 3-phase inverter configuration with built-in protection functions such as under-voltage lockout (UVLO), short-circuit protection (SCP), and thermal monitoring via LVIC temperature sensing.

 

The module uses a low-thermal-resistance Al2O3 DBC substrate and is housed in a 27-PowerDIP through-hole package. It supports 3.3V/5V logic interface with active-HIGH Schmitt-trigger inputs. Separate open-emitter pins for low-side IGBTs enable three-phase current sensing.

 

Applications include motion control for home appliances and industrial motors, as well as three-phase DC/AC power conversion. The device is Pb-Free and Halide Free.

FNB33060T Quick Information

Product Type: Power Driver Module
Series: SPM27
Canonical Name: FNB33060T Motion SPM 3 Series 600V 30A 3-Phase IGBT Inverter Module
Subcategory: 3-Phase Inverter

FNB33060T Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected
Lead Free: Yes

FNB33060T Estimated Pricing

Qty Low High
1+ $25.67 $25.67
10+ $18.65 $18.65

Estimated market price range - modelled values for guidance only, not live distributor offers.

FNB33060T Features

  • 600V, 30A IGBT inverter module.
  • Integrated gate drivers and protection.
  • 2500 Vrms isolation rating.
  • Through-hole 27-PowerDIP package.
  • Al2O3 DBC substrate for low thermal resistance.

FNB33060T Applications

  • AC induction motor control applications.
  • BLDC and PMSM motor drives.
  • Three-phase DC/AC power conversion.
  • Home appliance and industrial motor control.

FNB33060T FAQs

7 frequently asked questions generated from this part’s specifications.
What is the operating voltage of the FNB33060T?

The IGBT voltage rating is 600V, and the isolation rating is 2500 Vrms.

What is the package type of the FNB33060T?

The FNB33060T is housed in a 27-PowerDIP Module (1.205", 30.60mm) through-hole package.

Is the FNB33060T RoHS compliant?

The device is marked as RoHS3 compliant and is Pb-Free and Halide Free per the datasheet.

What is the current rating of the FNB33060T?

The module is rated for 30A continuous current.

What protection features does the FNB33060T include?

It includes under-voltage lockout (UVLO), short-circuit protection (SCP), and thermal monitoring.

What logic interface does the FNB33060T support?

The module supports 3.3V/5V logic with active-HIGH Schmitt-trigger inputs.

What substrate material is used in the FNB33060T?

The module uses Al2O3 DBC substrate for low thermal resistance.

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