| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
30,133 pcs
|
30133 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
|
692 pcs
|
692 pcs | On Request | 1 | On Request | On Request | 13+ | On Request | On Request |
| Category | |
| Manufacturer Name | |
| AEC Qualified | |
| Automotive Grade | |
| Data Rate | |
| Function | |
| Industrial Grade | |
| Input Type | |
| Lead Spacing | |
| Medical Grade | |
| Military Grade | |
| Mounting Type | |
| Number of Inputs | |
| Number of Outputs | |
| Operating Temperature | |
| Output Type | |
| Supplier Device Package | |
| Supplier Package | |
| Tape & Reel | |
| Voltage |
The FIN1217MTD by On Semiconductor is a 21-bit LVDS Serializer/Deserializer IC designed for high-speed data transmission. It transforms 21-bit parallel LVTTL data into three serial LVDS data streams, with a phase-locked transmit clock transmitted over a separate LVDS link. This device supports shift clock frequencies ranging from 20MHz to 85MHz, enabling a high throughput of up to 1.785Gbps, or 595Mbps per channel.
Operating within a voltage range of 3V to 3.6V, the FIN1217MTD functions across an industrial temperature range of -40°C to 85°C. It is compatible with the TIA/EIA-644 specification. The component is housed in a 48-lead TSSOP package, suitable for surface mounting.
This chipset is engineered to address EMI and cable size challenges associated with wide and high-speed TTL interfaces. The FIN1217MTD is offered in a 48-lead Thin Shrink Small Outline Package (TSSOP) and is available on tape and reel, facilitating automated assembly processes.
20MHz to 85MHz
Up to 595Mbps
48-Lead Thin Shrink Small Outline Package (TSSOP)
3V to 3.6V
-40°C to 85°C
Yes, RoHS3 Compliant
Yes, Lead Free