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FGM230SA27HGN3 The Silicon Labs FGM230SA27HGN3 is a proprietary SiP module for wireless connectivities. It features a 39 MHz ARM Cortex-M33 core and robust RF performance.
Mfr Part #:

FGM230SA27HGN3

Available from 1 distributors
Mfr Name: Silicon Labs
Silicon Labs
The Silicon Labs FGM230SA27HGN3 is a proprietary SiP module for wireless connectivities. It features a 39 MHz ARM Cortex-M33 core and robust RF performance.
Total Stock: 180 pcs
$ Price Range: $0.99

FGM230SA27HGN3 Available from 1 distributor

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Non-Authorised
Distributor Stock Pricing MOQ PKG Lead Time Date Code On Order Quantity On Order Delivery
Non-Authorised Inventory information
180 pcs
180 pcs On Request 1 On Request On Request On Request On Request 2026-02-16 21:33:16

FGM230SA27HGN3 Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Antenna Type
Core Frequency
Core Processor
Current
Current - Supply
Data Rate
Flash Memory
Frequency
GPIO Pins
Memory Size
Modulation
Mounting Type
Operating Temperature
Operating Voltage
Power
RAM Memory
RF Family
Rx Sensitivity
Sensitivity
Serial Interfaces
TX power
Tape & Reel
Utilized IC
Voltage

FGM230SA27HGN3 Description

Short technical summary and product information.

The FGM230SA27HGN3 is a System-in-Package (SiP) module designed for proprietary wireless applications, built on the EFR32FG23 SoC. It offers robust RF performance, long-range capabilities, advanced security features, and low-current consumption.

 

Key electrical specifications include a TX power of +14 dBm and an RX sensitivity of -109.8 dBm at 100 kbps. The module is powered by a 32-bit ARM Cortex-M33 core operating at 39 MHz, with 512 kB of Flash memory and 64 kB of RAM. It supports a wide range of serial interfaces including GPIO, I²C, SPI, and UART.

 

This module operates within a frequency range of 863MHz to 870MHz and 902MHz to 928MHz. It is housed in a 6.5 mm x 6.5 mm package and is designed for surface mount installation. The operating temperature range is -40°C to 85°C, making it suitable for demanding environments.

 

The FGM230SA27HGN3 is targeted for applications such as metering, home and building automation, industrial automation, and street lighting. It provides a complete solution with powerful software support and development tools to accelerate product development and time-to-market.

FGM230SA27HGN3 Quick Information

Product Type: SiP Module
Canonical Name: FGM230SA27HGN3 SiP Module
Subcategory: SiP Module

FGM230SA27HGN3 Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

FGM230SA27HGN3 Estimated Pricing

Qty Low High
1+ $0.99 $0.99

Estimated market price range - modelled values for guidance only, not live distributor offers.

FGM230SA27HGN3 Features

  • Proprietary uncertified wireless connectivity.
  • Robust RF performance with +14 dBm TX power.
  • High RX sensitivity of -109.8 dBm at 100 kbps.
  • 32-bit ARM Cortex-M33 core at 39 MHz.
  • Compact 6.5 mm x 6.5 mm package.

FGM230SA27HGN3 Applications

  • Ideal for metering applications.
  • Suitable for home automation and security.
  • Used in industrial automation systems.
  • Applicable for street lighting control.

FGM230SA27HGN3 FAQs

7 frequently asked questions generated from this part’s specifications.
What is the operating temperature range for the FGM230SA27HGN3?

-40°C to 85°C

What is the package type for the FGM230SA27HGN3?

48-SMD Module

What is the TX power of the FGM230SA27HGN3 module?

+14 dBm

What is the RX sensitivity of the FGM230SA27HGN3 at 100 kbps?

-109.8 dBm

What is the core processor and frequency for the FGM230SA27HGN3?

32-bit ARM Cortex-M33 core at 39 MHz

How much Flash and RAM memory does the FGM230SA27HGN3 have?

512 kB Flash, 64 kB RAM

What serial interfaces are supported by the FGM230SA27HGN3?

GPIO, I²C, I²S, IrDA, JTAG, SPI, UART, USART

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