| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
180 pcs
|
180 pcs | On Request | 1 | On Request | On Request | On Request | On Request | 2026-02-16 21:33:16 |
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The FGM230SA27HGN3 is a System-in-Package (SiP) module designed for proprietary wireless applications, built on the EFR32FG23 SoC. It offers robust RF performance, long-range capabilities, advanced security features, and low-current consumption.
Key electrical specifications include a TX power of +14 dBm and an RX sensitivity of -109.8 dBm at 100 kbps. The module is powered by a 32-bit ARM Cortex-M33 core operating at 39 MHz, with 512 kB of Flash memory and 64 kB of RAM. It supports a wide range of serial interfaces including GPIO, I²C, SPI, and UART.
This module operates within a frequency range of 863MHz to 870MHz and 902MHz to 928MHz. It is housed in a 6.5 mm x 6.5 mm package and is designed for surface mount installation. The operating temperature range is -40°C to 85°C, making it suitable for demanding environments.
The FGM230SA27HGN3 is targeted for applications such as metering, home and building automation, industrial automation, and street lighting. It provides a complete solution with powerful software support and development tools to accelerate product development and time-to-market.
| Qty | Low | High |
|---|---|---|
| 1+ | $0.99 | $0.99 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
-40°C to 85°C
48-SMD Module
+14 dBm
-109.8 dBm
32-bit ARM Cortex-M33 core at 39 MHz
512 kB Flash, 64 kB RAM
GPIO, I²C, I²S, IrDA, JTAG, SPI, UART, USART