| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
9 pcs
|
9 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The Samtec ESW-113-33-G-D is a 26-position elevated socket designed for board-to-board stacking applications. It features two rows of 13 contacts each at a 2.54mm pitch, with a 2.54mm row spacing. The socket uses phosphor bronze contacts with a 20µin (0.51µm) gold plating over 50µin nickel, ensuring reliable connections. The through-hole solder tail termination provides secure mechanical mounting. Rated at 5.2A per contact (2 pins powered) and up to 515VAC (mated with TSW or ESQ), it operates from -55°C to 125°C with gold plating. The black glass-filled polyester insulator meets UL94 V-0 flammability rating. An insertion depth of 3.68mm to 6.35mm accommodates various mating headers, and the connector supports up to 100 mating cycles with the specified gold thickness. Note: This part is not lead-free solderable; only lead wave soldering is recommended.
26 positions in a double row configuration.
2.54mm (0.100") pitch with 2.54mm row spacing.
5.2A per contact when 2 pins are powered (mated with TSW).
515 VAC mated with TSW or ESQ (per datasheet).
Through hole with solder tail termination.
-55°C to +125°C with gold plating.
20µin (0.51µm) gold plating over 50µin nickel.