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| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
15 pcs
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15 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Connector Type | |
| Contact Finish | |
| Contact Finish Thickness | |
| Contact Length | |
| Contact Plating | |
| Contact Type | |
| Current Rating | |
| Current Rating (Amps) | |
| Fastening Type | |
| Insertion Depth | |
| Insulation Color | |
| Insulation Height | |
| Insulation Material | |
| Material Flammability Rating | |
| Max Cycles | |
| Mounting Type | |
| Number of Positions | |
| Number of Positions Loaded | |
| Number of Rows | |
| Operating Temperature | |
| Pitch | |
| Row Spacing | |
| Style | |
| Tail Plating | |
| Termination | |
| Voltage Rating |
The Samtec ESW-108-44-L-D is a 16-position elevated socket connector designed for board-to-board stacking applications. It features a dual-row configuration with 2.54mm pitch and row spacing, housed in a black glass filled polyester insulator with UL94 V-0 flammability rating.
Electrical specifications include a current rating of 5.2A per pin (with 2 pins powered) and a voltage rating of 515VAC when mated with TSW or ESQ headers. The operating temperature range is -55°C to +125°C with gold contact plating. Contact plating consists of 10µ" gold over 50µ" nickel on the contact area, with matte tin on the solder tail.
Mechanical characteristics include through hole mounting with solder termination, 18.67mm insulation height, 4.57mm contact length (lead style 44), and a push-pull fastening type. The forked contact design supports an insertion depth of 3.68mm to 6.35mm and is rated for 100 mating cycles with gold plating.
16 positions in 2 rows (2 rows × 8 positions per row).
2.54mm (0.100") pitch and row spacing.
5.2A per pin with 2 pins powered.
515VAC when mated with TSW or ESQ headers.
Through hole with solder termination.
-55°C to +125°C with gold plating.
10µ" gold over 50µ" nickel on contact area, matte tin on solder tail.