| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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1,900 pcs
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1900 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The Intel EPF10K70RC240-3N is an embedded programmable logic device (PLD) from the FLEX 10K family, designed for System-on-a-Programmable-Chip (SOPC) integration. This FPGA features a high density of 3,744 logic elements (LEs) and 468 logic array blocks (LABs), providing substantial capacity for complex logic functions.
Key electrical specifications include 18,432 total RAM bits and 189 I/O pins, supporting a supply voltage range of 4.75V to 5.25V. The device operates within a temperature range of 0°C to 70°C (TA). It also supports industry standards such as PCI Local Bus Specification Revision 2.2 and IEEE Std. 1149.1-1990 JTAG boundary-scan testing.
Packaged in a 240-RQFP format with surface mount mounting type, the EPF10K70RC240-3N is suitable for various applications requiring flexible and programmable logic. Its design incorporates an embedded array for implementing megafunctions like memory and specialized logic, alongside a logic array for general logic functions.
The EPF10K70RC240-3N features 3,744 logic elements, 468 logic array blocks, 18,432 RAM bits, and 189 I/O pins. It operates with a supply voltage between 4.75V and 5.25V.
The operating temperature range for the EPF10K70RC240-3N is 0°C to 70°C (TA).
The EPF10K70RC240-3N is available in a 240-RQFP package with an exposed pad, designed for surface mounting. It is also supplied in a tray package.
Yes, the FLEX 10K and FLEX 10KA devices, including the EPF10K70RC240-3N, support the Peripheral Component Interconnect Special Interest Group (PCI SIG) PCI Local Bus Specification, Revision 2.2.
The EPF10K70RC240-3N includes built-in Joint Test Action Group (JTAG) boundary-scan test (BST) circuitry compliant with IEEE Std. 1149.1-1990.