| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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1,700 pcs
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1700 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The Intel EPF10K50RC240-4 is an embedded programmable logic device (PLD) from the FLEX 10K family, designed for System-on-a-Programmable-Chip (SOPC) integration. This FPGA offers a high density of 2880 logic elements and 360 logic array blocks (LABs), complemented by 20,480 bits of embedded RAM.
Key electrical specifications include a supply voltage range of 4.75V to 5.25V and an operating temperature range of 0°C to 70°C (TA). With 189 I/O pins, it provides extensive connectivity options for complex digital systems. The device is fabricated using advanced processes and supports in-circuit reconfigurability.
This FPGA is housed in a 240-pin RQFP package, specifically a 240-BFQFP Exposed Pad, and is designed for surface mount applications. It is suitable for various applications including telecommunications, industrial automation, medical equipment, and consumer electronics, offering robust RAM capacity and high logic density for demanding digital circuit implementations.
The EPF10K50RC240-4 FPGA has 2880 logic elements.
The EPF10K50RC240-4 FPGA includes 20480 bits of RAM.
The operating temperature range for the EPF10K50RC240-4 is 0°C to 70°C (TA).
The supply voltage for the EPF10K50RC240-4 FPGA is between 4.75V and 5.25V.
The EPF10K50RC240-4 FPGA is supplied in a 240-pin RQFP package, specifically a 240-BFQFP Exposed Pad, and also noted as Tray packaging.
The Moisture Sensitivity Level (MSL) for the EPF10K50RC240-4 is MSL 3 (168 Hours).