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EPF10K100EFC484-3 The EPF10K100EFC484-3 is an FPGA device from Intel featuring 257,000 logic gates and 4992 logic elements, housed in a 484FBGA package.
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EPF10K100EFC484-3

Available from 1 distributors
Mfr Name: Intel
Intel
The EPF10K100EFC484-3 is an FPGA device from Intel featuring 257,000 logic gates and 4992 logic elements, housed in a 484FBGA package.
✓ Total Stock: 2 pcs

EPF10K100EFC484-3 Available from 1 distributor

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Components Technology Group, Inc. ✓
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2 pcs
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EPF10K100EFC484-3 Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Lead Spacing
Mounting Type
Number of Gates
Number of I
Number of LABs
Number of Logic Elements
Operating Temperature
Supplier Device Package
Total RAM Bits
Voltage
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EPF10K100EFC484-3 Description

Short technical summary and product information.

The EPF10K100EFC484-3 is a field programmable gate array (FPGA) manufactured by Intel. It offers a logic density of 257,000 gates and contains 4992 logic elements, making it suitable for complex digital designs. The device is packaged in a 484-ball fine-pitch ball grid array (FBGA) package, with 338 input/output pins, supporting high-density interconnections for embedded applications.

 

This FPGA is designed for use in embedded systems requiring high logic capacity and flexible I/O configurations. Its architecture supports various digital logic functions, making it suitable for applications such as communications, industrial automation, and consumer electronics. The package's ball grid array format allows for surface-mount assembly on printed circuit boards, facilitating integration into compact electronic devices.

EPF10K100EFC484-3 Quick Information

Product Type: FPGA (Field Programmable Gate Array)
Canonical Name: EPF10K100EFC484-3

EPF10K100EFC484-3 Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

EPF10K100EFC484-3 Features

  • Contains 257,000 logic gates for complex designs.
  • Includes 4,992 logic elements for versatile applications.
  • High-density FPGA with 249 I/O pins.
  • Package type is 329-PBGA (31x31).
  • Operates within 0°C to 70°C temperature range.

EPF10K100EFC484-3 Applications

  • Suitable for complex embedded digital designs
  • Used in communications equipment
  • Ideal for industrial automation systems
  • Supports high-density surface mounting

EPF10K100EFC484-3 FAQs

2 frequently asked questions generated from this part’s specifications.
What is the logic density of the FPGA?

The FPGA has a logic density of 257,000 gates.

How many logic elements does the FPGA contain?

The FPGA contains 4992 logic elements.

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