| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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492 pcs
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492 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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This Intel FPGA, part number EP4SGX70DF29C2XN, is designed for embedded applications requiring high-density logic and I/O capabilities. It offers 72,600 logic elements and 2,904 LABs, supported by 7,564,880 total RAM bits.
The device operates within a temperature range of 0°C to 85°C (TJ) and requires an operating voltage between 0.87V and 0.93V. It features 372 I/O pins, making it suitable for complex digital signal processing and system-on-chip designs.
The EP4SGX70DF29C2XN comes in a 780-FBGA (29x29) package, designed for surface mounting. Its robust construction and specifications make it a reliable choice for demanding applications in various industries.
Environmental compliance includes RoHS3 compliance, MSL 1 (Unlimited) moisture sensitivity, and REACH unaffected status. These attributes ensure suitability for a wide range of manufacturing processes and global market requirements.
The EP4SGX70DF29C2XN FPGA has 72,600 logic elements.
The operating temperature range for the EP4SGX70DF29C2XN FPGA is 0°C to 85°C (TJ).
The EP4SGX70DF29C2XN is supplied in a 780-FBGA (29x29) package, designed for surface mounting.
The operating voltage for this FPGA is between 0.87V and 0.93V.
This FPGA provides 372 I/O pins.