EP4SGX180DF29I3N The EP4SGX180DF29I3N is an FPGA device with 372 I/O pins, designed for embedded applications. It features a 780-FBGA package and operates within -40°C to 100°C.
Mfr Part #:

EP4SGX180DF29I3N

Available from 1 distributors
Mfr Name: Intel
Intel
The EP4SGX180DF29I3N is an FPGA device with 372 I/O pins, designed for embedded applications. It features a 780-FBGA package and operates within -40°C to 100°C.
Total Stock: 180 pcs

EP4SGX180DF29I3N Available from 1 distributor

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EP4SGX180DF29I3N Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Mounting Type
Number of I
Number of LABs
Number of Logic Elements
Operating Temperature
Supplier Device Package
Total RAM Bits
Voltage

EP4SGX180DF29I3N Description

Short technical summary and product information.

The EP4SGX180DF29I3N is a field-programmable gate array (FPGA) manufactured by Intel. It features 372 input/output pins and is packaged in a 780-FBGA (29x29 mm) form factor. The device supports a supply voltage range of 0.87V to 0.93V and is suitable for applications requiring high logic density and I/O capacity. Its thermal operating range is from -40°C to 100°C, making it suitable for a variety of embedded systems.

 

This FPGA provides a total of 13,954,048 RAM bits and contains 175,750 logic elements or cells, enabling complex digital logic implementation. Its surface-mount design allows for reliable integration into printed circuit boards, especially in space-constrained environments. The device is used in applications such as communications, industrial automation, and advanced computing systems where high I/O count and logic density are essential.

EP4SGX180DF29I3N Quick Information

Product Type: FPGA (Field Programmable Gate Array)
Canonical Name: EP4SGX180DF29I3N

EP4SGX180DF29I3N Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

EP4SGX180DF29I3N Features

  • High I/O count with 372 pins
  • Surface mount package for reliable assembly
  • Operates within -40°C to 100°C temperature range
  • Includes 13.95 million RAM bits
  • Contains 175,750 logic elements

EP4SGX180DF29I3N Applications

  • Used in embedded digital logic systems
  • Suitable for high-density FPGA applications
  • Ideal for industrial automation systems
  • Applicable in communication hardware

EP4SGX180DF29I3N FAQs

3 frequently asked questions generated from this part’s specifications.
What is the number of I/O pins on the EP4SGX180DF29I3N?

The EP4SGX180DF29I3N has 372 I/O pins.

What is the operating temperature range of the EP4SGX180DF29I3N?

The operating temperature range is -40°C to 100°C.

What package type does the EP4SGX180DF29I3N use?

It uses a 780-FBGA (29x29 mm) package.

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