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EP3SL200F1152C3N The Intel EP3SL200F1152C3N is an FPGA with 200,000 logic elements and 744 I/O pins. It features a 1152-FBGA package and operates between 0°C and 85°C.
Mfr Part #:

EP3SL200F1152C3N

Available from 1 distributors
Mfr Name: Intel
Intel
The Intel EP3SL200F1152C3N is an FPGA with 200,000 logic elements and 744 I/O pins. It features a 1152-FBGA package and operates between 0°C and 85°C.
✓ Total Stock: 3,658 pcs

EP3SL200F1152C3N Available from 1 distributor

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Components Technology Group, Inc. ✓
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3,658 pcs
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EP3SL200F1152C3N Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Lead Spacing
Mounting Type
Number of I
Number of LABs
Number of Logic Elements
Operating Temperature
Supplier Device Package
Total RAM Bits
Voltage
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EP3SL200F1152C3N Description

Short technical summary and product information.

The Intel EP3SL200F1152C3N is a Field Programmable Gate Array (FPGA) designed for complex digital logic applications. This device offers 200,000 logic elements and supports 744 input/output (I/O) pins, providing significant flexibility for custom hardware designs.

 

With a total RAM bit count of 10,901,504, the EP3SL200F1152C3N is suitable for memory-intensive tasks. It operates within a voltage range of 0.86V to 1.15V and has an operating temperature range of 0°C to 85°C (TJ).

 

The FPGA is housed in a 1152-FBGA (35x35) package, designed for surface mounting. The package type is specified as 1152-BBGA, FCBGA. This component is part of the Stratix III family, known for its performance and features in programmable logic solutions.

EP3SL200F1152C3N Quick Information

Product Type: FPGA
Series: Stratix III
Canonical Name: Intel EP3SL200F1152C3N FPGA
Subcategory: Field Programmable Gate Array

EP3SL200F1152C3N Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

EP3SL200F1152C3N Features

  • 200,000 logic elements available.
  • 744 input/output pins.
  • 10,901,504 total RAM bits.
  • Surface mountable 1152-FBGA package.
  • 0°C to 85°C operating temperature range.

EP3SL200F1152C3N Applications

  • Suitable for FPGA-based digital signal processing.
  • Ideal for high-density logic implementation.
  • Used in complex embedded system designs.
  • Applicable in telecommunications equipment.
  • Suitable for data center acceleration cards.

EP3SL200F1152C3N FAQs

6 frequently asked questions generated from this part’s specifications.
How many logic elements does the EP3SL200F1152C3N have?

The EP3SL200F1152C3N has 200,000 logic elements.

What is the operating voltage for the EP3SL200F1152C3N?

The operating voltage for the EP3SL200F1152C3N is between 0.86V and 1.15V.

What is the operating temperature range of the EP3SL200F1152C3N?

The EP3SL200F1152C3N operates from 0°C to 85°C (TJ).

What package type is the EP3SL200F1152C3N in?

The EP3SL200F1152C3N is in a 1152-FBGA (35x35) package.

What is the mounting type for the EP3SL200F1152C3N?

The mounting type for the EP3SL200F1152C3N is Surface Mount.

How many I/O pins does the EP3SL200F1152C3N feature?

The EP3SL200F1152C3N features 744 I/O pins.

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