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547 pcs
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547 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The Intel EP3SE80F1152C3N is a Field Programmable Gate Array (FPGA) designed for custom digital circuit applications. It features 80,000 logic elements and 3,200 Logic Array Blocks (LABs), providing substantial capacity for complex designs. The device includes 6,843,392 total RAM bits for embedded memory functions.
With 744 general-purpose input/output pins, this FPGA offers extensive connectivity for high-density signal interfaces. It operates within a voltage range of 0.86V to 1.15V and has an operating junction temperature range of 0°C to 85°C. The component is supplied in a 1152-ball Fine-Pitch Ball Grid Array (FBGA) package with dimensions of 35x35mm, suitable for surface mounting.
This FPGA is suitable for applications requiring high-speed logic configuration, advanced logic and arithmetic functions, and flexible reprogrammability. Its structure typically includes logic array blocks, embedded memory, clock management circuits, and DSP blocks, making it adaptable for various embedded systems.
The EP3SE80F1152C3N FPGA has 80,000 logic elements.
The EP3SE80F1152C3N FPGA features 744 I/O pins.
The operating voltage range for the EP3SE80F1152C3N FPGA is 0.86V to 1.15V.
The EP3SE80F1152C3N FPGA is supplied in a 1152-FBGA (35x35) package.
The operating temperature for the EP3SE80F1152C3N FPGA is 0°C to 85°C (TJ).
The Moisture Sensitivity Level (MSL) for the EP3SE80F1152C3N FPGA is 1 Unlimited.