| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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3 pcs
|
3 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
|
3 pcs
|
3 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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| Number of Logic Elements | |
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| Total RAM Bits | |
| Voltage |
The Intel EP3C55F484I7 is a member of the Cyclone III FPGA family, designed for high-volume, low-power, and cost-sensitive applications. This device offers a balance of high functionality and low power consumption, built on TSMC's low-power process technology.
Key specifications include 55856 logic elements (LEs) and 3491 logic array blocks (LABs), providing significant processing capability. It features 2,396,160 total RAM bits for data storage and buffering. The FPGA offers 327 I/O pins for interfacing with other components.
Operating within a voltage range of 1.15V to 1.25V, the EP3C55F484I7 is designed for efficiency. It has an operating temperature range of -40°C to 100°C (TJ), making it suitable for various environmental conditions. The device is supplied in a 484-FBGA (23x23) package and uses surface mount technology for integration into printed circuit boards.
This FPGA variant is optimized for low static power consumption, contributing to extended battery life in portable applications and reduced cooling system costs. Its architecture supports design separation for enhanced IP protection and redundancy.
The EP3C55F484I7 FPGA has 55856 logic elements.
The EP3C55F484I7 offers 327 I/O pins.
The operating voltage range for the EP3C55F484I7 is 1.15V to 1.25V.
The EP3C55F484I7 is supplied in a 484-FBGA (23x23) package.
The operating temperature range for the EP3C55F484I7 is -40°C to 100°C (TJ).
The EP3C55F484I7 has 2,396,160 total RAM bits.