| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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2,654 pcs
|
2654 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The Intel EP3C25F324C8N is a Field Programmable Gate Array (FPGA) from the Cyclone III family. It offers 24,624 logic elements and 1,539 logic array blocks (LABs), providing significant processing capability for custom digital logic designs.
This FPGA includes 608,256 bits of total RAM and supports 215 input/output (I/O) pins, enabling flexible interfacing with other system components. It operates within a supply voltage range of 1.15V to 1.25V and has an operating temperature range of 0°C to 85°C (TJ).
The device is housed in a 324-BGA package and is designed for surface mounting. The Cyclone III family is known for its combination of high functionality, low power consumption, and cost-effectiveness, making it suitable for high-volume applications.
Key specifications include 24,624 logic elements, 215 I/O pins, and 608,256 total RAM bits. The operating temperature is 0°C to 85°C (TJ), and the supply voltage is between 1.15V and 1.25V. The package type is 324-FBGA (19x19) for surface mount applications.
The EP3C25F324C8N has 24,624 logic elements.
The EP3C25F324C8N offers 215 I/O pins.
The EP3C25F324C8N has a total of 608,256 RAM bits.
The EP3C25F324C8N operates within a supply voltage range of 1.15V to 1.25V.
The operating temperature range for the EP3C25F324C8N is 0°C to 85°C (TJ).
The EP3C25F324C8N is in a 324-FBGA (19x19) package.
The EP3C25F324C8N is a surface mount device.