DistyParts Icon
EP3C25F324C6N The EP3C25F324C6N is an FPGA device from Intel featuring 24,624 logic elements and 215 I/O pins, housed in a 324-BGA package.
Mfr Part #:

EP3C25F324C6N

Available from 1 distributors
Mfr Name: Intel
Intel
The EP3C25F324C6N is an FPGA device from Intel featuring 24,624 logic elements and 215 I/O pins, housed in a 324-BGA package.
✓ Total Stock: 3 pcs

EP3C25F324C6N Available from 1 distributor

✓ Authorised
✓ Non-Authorised
Distributor Stock Pricing MOQ PKG Lead Time Date Code On Order Quantity On Order Delivery
Components Technology Group, Inc. ✓
Non-Authorised Inventory information
3 pcs
On Request
3 pcs On Request 1 On Request On Request On Request On Request On Request
DistyParts aggregates offers from multiple distributors. Final prices, lead times and terms are subject to the distributors' discretion and may change without prior notice. DistyParts is not liable for any discrepancies.

EP3C25F324C6N Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Lead Spacing
Mounting Type
Number of I
Number of LABs
Number of Logic Elements
Operating Temperature
Supplier Device Package
Supplier Package
Total RAM Bits
Voltage
Voltage Supply
View Similar Products (0)

EP3C25F324C6N Description

Short technical summary and product information.

The Intel EP3C25F324C6N is a field programmable gate array (FPGA) designed for embedded applications. It contains 24,624 logic elements and 1,539 logic array blocks, providing substantial programmable logic capacity. The device includes 608,256 RAM bits and 215 input/output pins, making it suitable for complex digital designs.

 

This FPGA is packaged in a 324-ball BGA (Ball Grid Array) with a 19x19 mm footprint, suitable for surface mounting on printed circuit boards. It operates within a voltage range of 1.15V to 1.25V and supports operating temperatures from 0°C to 85°C. The device is compliant with RoHS standards, although this status is unverified. It is intended for use in embedded systems requiring high logic density and I/O flexibility.

 

Designed for applications such as digital signal processing, communications, and industrial automation, the EP3C25F324C6N offers a reliable and versatile platform for complex FPGA implementations. Its surface-mount package facilitates integration into compact electronic assemblies.

EP3C25F324C6N Quick Information

Product Type: FPGA
Series: Cyclone III
Canonical Name: Intel EP3C25F324C6N FPGA
Subcategory: Field Programmable Gate Array

EP3C25F324C6N Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

EP3C25F324C6N Features

  • High logic element count of 24,624
  • 215 I/O pins for versatile connectivity
  • Surface mount 324-BGA package
  • Operates at 1.15V to 1.25V
  • Supports temperature range 0°C to 85°C

EP3C25F324C6N Applications

  • Suitable for high-density FPGA designs.
  • Ideal for low-power embedded applications.
  • Used in industrial automation systems.
  • Applicable in data processing and networking.
  • Suitable for security-sensitive FPGA implementations.

EP3C25F324C6N FAQs

5 frequently asked questions generated from this part’s specifications.
What is the logic element count of the EP3C25F324C6N?

The EP3C25F324C6N contains 24,624 logic elements.

How many I/O pins does the EP3C25F324C6N have?

The device has 215 I/O pins.

What is the operating voltage range for the EP3C25F324C6N?

It operates within a voltage range of 1.15V to 1.25V.

What package type is used for the EP3C25F324C6N?

It is housed in a 324-BGA package.

What is the operating temperature range for this FPGA?

It operates from 0°C to 85°C.

Home
Account

Categories