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EP3C25F256C8N The Intel EP3C25F256C8N is a Field Programmable Gate Array (FPGA) with 24,624 logic elements and 156 I/O pins. It operates at 1.15V to 1.25V and is designed for surface mounting.
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EP3C25F256C8N

Available from 1 distributors
Mfr Name: Intel
Intel
The Intel EP3C25F256C8N is a Field Programmable Gate Array (FPGA) with 24,624 logic elements and 156 I/O pins. It operates at 1.15V to 1.25V and is designed for surface mounting.
✓ Total Stock: 3 pcs

EP3C25F256C8N Available from 1 distributor

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Components Technology Group, Inc. ✓
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3 pcs
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EP3C25F256C8N Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Lead Spacing
Mounting Type
Number of I
Number of LABs
Number of Logic Elements
Operating Temperature
Supplier Device Package
Supplier Package
Total RAM Bits
Voltage
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EP3C25F256C8N Description

Short technical summary and product information.

The Intel EP3C25F256C8N is a member of the Cyclone III FPGA family, designed for high-volume, low-power, and cost-sensitive applications. This device features 24,624 logic elements and 1,539 logic array blocks (LABs), providing significant processing capability.

 

It offers 608,256 total RAM bits for data storage and 156 input/output (I/O) pins for interfacing with other components. The operating voltage ranges from 1.15V to 1.25V, contributing to its low-power characteristics. The operating temperature range is 0°C to 85°C (TJ).

 

This FPGA is packaged in a 256-FBGA (17x17) format, with a corresponding case code of 256-LBGA. It is designed for surface mount applications, requiring specific soldering techniques for integration into printed circuit boards. The device is RoHS3 compliant and has an MSL rating of 1 Unlimited.

 

The Cyclone III family, based on TSMC's low-power process technology, is optimized for applications where power consumption is a critical factor, such as portable and handheld devices, or systems with reduced cooling requirements.

EP3C25F256C8N Quick Information

Product Type: FPGA
Canonical Name: EP3C25F256C8N FPGA
Subcategory: Field Programmable Gate Array

EP3C25F256C8N Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

EP3C25F256C8N Features

  • 24,624 logic elements for complex designs.
  • 156 I/O pins for versatile connectivity.
  • 608,256 total RAM bits for data storage.
  • Surface mountable 256-FBGA package.
  • 0°C to 85°C operating temperature range.

EP3C25F256C8N Applications

  • Ideal for low-power applications.
  • Suitable for portable device integration.
  • Cost-sensitive high-volume designs.
  • Embedded system development.

EP3C25F256C8N FAQs

7 frequently asked questions generated from this part’s specifications.
How many logic elements does the EP3C25F256C8N FPGA have?

The EP3C25F256C8N FPGA has 24,624 logic elements.

What is the total RAM bit count for this FPGA?

This FPGA has a total of 608,256 RAM bits.

How many I/O pins are available on the EP3C25F256C8N?

The EP3C25F256C8N features 156 I/O pins.

What is the operating voltage range for the EP3C25F256C8N?

The operating voltage range is 1.15V to 1.25V.

What is the operating temperature range of this FPGA?

The operating temperature range is 0°C to 85°C (TJ).

What type of package is the EP3C25F256C8N in?

The EP3C25F256C8N is in a 256-FBGA (17x17) package, also referred to as 256-LBGA.

Is the EP3C25F256C8N suitable for surface mounting?

Yes, the EP3C25F256C8N is designed for surface mount applications.

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