| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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10,000 pcs
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10000 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The Intel EP3C16F256I7N is a Field Programmable Gate Array (FPGA) designed for high-volume, low-power, and cost-sensitive applications. It offers 15,408 logic elements and 963 Logic Array Blocks (LABs), providing significant processing capability.
This FPGA features 168 I/O pins and 516,096 bits of embedded memory. It operates at a voltage range of 1.15V to 1.25V and is specified for an operating temperature range of -40°C to 100°C (TJ).
The device is housed in a 256-FBGA (17x17) package and supports surface mount installation. Its low-power characteristics, derived from TSMC's low-power process technology, make it suitable for applications where power consumption is a critical factor, such as portable and handheld devices.
The Cyclone III family, to which this device belongs, emphasizes a balance of high functionality, low power, and cost-effectiveness. This particular model, EP3C16F256I7N, is part of a series known for its efficient power management.
The operating temperature range is -40°C to 100°C (TJ).
The device is supplied in a 256-FBGA (17x17) package.
The operating voltage is between 1.15V and 1.25V.
The EP3C16F256I7N FPGA has 168 I/O pins.
The total RAM bit count is 516096 bits.
The EP3C16F256I7N FPGA contains 15408 logic elements.
The mounting type is Surface Mount.