EP2SGX90EF1152C3 The Intel EP2SGX90EF1152C3 is a high-performance FPGA from the Stratix II GX family. It features 90,960 logic elements and 558 I/O pins, suitable for complex embedded systems.
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EP2SGX90EF1152C3

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Mfr Name: Intel
Intel
The Intel EP2SGX90EF1152C3 is a high-performance FPGA from the Stratix II GX family. It features 90,960 logic elements and 558 I/O pins, suitable for complex embedded systems.
Total Stock: 3 pcs

EP2SGX90EF1152C3 Available from 1 distributor

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EP2SGX90EF1152C3 Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Lead Spacing
Mounting Type
Number of I
Number of LABs
Number of Logic Elements
Operating Temperature
Supplier Device Package
Total RAM Bits
Voltage

EP2SGX90EF1152C3 Description

Short technical summary and product information.

The Intel EP2SGX90EF1152C3 is a Field Programmable Gate Array (FPGA) belonging to the Stratix II GX family. This device offers a substantial 90,960 logic elements and 4,548 Logic Array Blocks (LABs), providing significant processing power for complex digital designs. It includes 4,520,448 total RAM bits for efficient data buffering and operations.

 

With 558 high-speed I/O pins, the EP2SGX90EF1152C3 is well-suited for parallel data transfer applications. It operates within a voltage range of 1.15V to 1.25V, optimizing power consumption. The device is designed for surface mounting and comes in a 1152-FBGA (35x35) package, supporting an operating temperature range of 0°C to 85°C (TJ).

 

The Stratix II GX architecture is built for high-performance applications, including high-speed backplane interfaces, chip-to-chip communication, and protocol bridging. These FPGAs combine high-speed serial transceivers with a scalable logic array, making them ideal for demanding telecommunications, data center infrastructure, networking equipment, and aerospace systems.

EP2SGX90EF1152C3 Quick Information

Product Type: FPGA
Series: Stratix II GX
Canonical Name: Intel EP2SGX90EF1152C3 FPGA
Subcategory: FPGA

EP2SGX90EF1152C3 Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

EP2SGX90EF1152C3 Features

  • 90,960 logic elements for complex designs.
  • 558 high-speed I/O pins available.
  • 4.52M RAM bits for efficient storage.
  • Operates at 1.15V to 1.25V.
  • Surface mount 1152-FBGA package.

EP2SGX90EF1152C3 Applications

  • Ideal for high-speed backplane interfaces.
  • Suitable for chip-to-chip communication.
  • Used in protocol bridging applications.
  • Designed for telecommunications systems.
  • Applicable in networking equipment.

EP2SGX90EF1152C3 FAQs

7 frequently asked questions generated from this part’s specifications.
What is the number of logic elements in the EP2SGX90EF1152C3?

The EP2SGX90EF1152C3 has 90,960 logic elements.

How many I/O pins does the EP2SGX90EF1152C3 have?

The EP2SGX90EF1152C3 features 558 I/O pins.

What is the operating voltage range for the EP2SGX90EF1152C3?

The operating voltage range for the EP2SGX90EF1152C3 is 1.15V to 1.25V.

What package type is the EP2SGX90EF1152C3 supplied in?

The EP2SGX90EF1152C3 is supplied in a 1152-FBGA (35x35) package.

What is the operating temperature for the EP2SGX90EF1152C3?

The operating temperature for the EP2SGX90EF1152C3 is 0°C to 85°C (TJ).

What is the total RAM bit count for the EP2SGX90EF1152C3?

The EP2SGX90EF1152C3 has a total of 4,520,448 RAM bits.

What is the number of Logic Array Blocks (LABs) in the EP2SGX90EF1152C3?

The EP2SGX90EF1152C3 contains 4,548 Logic Array Blocks (LABs).

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