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4,000 pcs
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4000 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The Intel EP2SGX30DF780C3N is a Field Programmable Gate Array (FPGA) from the Stratix II GX series. It offers a substantial 33,880 logic elements and 1,694 logic array blocks, providing significant capacity for complex designs.
This FPGA includes 1.37 Mbits of total RAM bits for data buffering and storage. It supports 361 user I/O pins, enabling flexible interfacing with other system components. The device operates within a voltage range of 1.15V to 1.25V and has an operating temperature range of 0°C to 85°C (TJ).
The EP2SGX30DF780C3N comes in a 780-FBGA (29x29) package, designed for surface mounting. Its architecture is built upon the Stratix II, offering high performance and flexibility for applications requiring scalable logic arrays and high-speed serial transceivers.
This FPGA is suitable for high-speed backplane interfaces, chip-to-chip communication, and protocol-bridging applications. Its features make it ideal for demanding tasks in communications, data processing, and networking.
The operating voltage for the EP2SGX30DF780C3N FPGA is between 1.15V and 1.25V.
The EP2SGX30DF780C3N FPGA has 33,880 logic elements.
The EP2SGX30DF780C3N FPGA is supplied in a 780-FBGA (29x29) package.
The operating temperature range for this FPGA is 0°C to 85°C (TJ).
The EP2SGX30DF780C3N FPGA offers 361 I/O pins.
The EP2SGX30DF780C3N FPGA has a total RAM capacity of 1,369,728 bits.