| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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29 pcs
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29 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
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2 pcs
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2 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The Intel EP2C50F672I8N is a Field Programmable Gate Array (FPGA) belonging to the Cyclone II family, known for its balance of performance, power efficiency, and cost-effectiveness. This device is designed to meet the demanding requirements of modern digital systems, offering a robust architecture with 50,528 logic elements and 3,158 Logic Array Blocks (LABs).
Key specifications include a total of 594,432 RAM bits for data storage and processing, and 450 I/O pins for interfacing with external devices. It operates within a voltage range of 1.15V to 1.25V and has an operating temperature range of -40°C to 100°C (TJ).
The EP2C50F672I8N is available in a 672-pin Fine Ball Grid Array (FBGA) package, suitable for surface mount applications. This packaging facilitates compact and reliable designs. The device is also RoHS compliant and REACH unaffected, meeting stringent environmental and regulatory standards.
This FPGA is ideal for applications in consumer electronics, industrial automation, telecommunications, medical devices, and automotive systems, supporting complex digital designs and a wide array of functions.
The EP2C50F672I8N FPGA is equipped with 50,528 logic elements and 3,158 Logic Array Blocks (LABs).
The device boasts a total of 594,432 RAM bits.
The EP2C50F672I8N FPGA features 450 I/O pins.
This FPGA operates within a voltage range of 1.15V to 1.25V.
The operating temperature range for the EP2C50F672I8N is -40°C to 100°C (TJ).
The EP2C50F672I8N FPGA is available in a 672-pin Fine Ball Grid Array (FBGA) package.
The device is RoHS3 compliant.