| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
2 pcs
|
2 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Mounting Type | |
| Number of I | |
| Number of LABs | |
| Number of Logic Elements | |
| Operating Temperature | |
| Supplier Device Package | |
| Supplier Package | |
| Tape & Reel | |
| Total RAM Bits | |
| Voltage |
The Intel EP2AGX65DF29C6N is a high-performance Field Programmable Gate Array (FPGA) designed for embedded applications. This device offers 60,214 logic elements and 2,530 LABs, providing significant processing power. It includes 364 I/O pins for flexible interfacing and 5,371,904 total RAM bits for data storage.
The FPGA operates within a voltage range of 0.87V to 0.93V and has an operating temperature range of 0°C to 85°C (TJ). It is designed for surface mounting and comes in a 780-FBGA (29x29) package, specifically a 780-BBGA, FCBGA type.
This component is suitable for various digital logic and signal processing tasks in embedded systems. Its robust specifications make it a reliable choice for applications requiring custom logic implementation and high-speed data handling.
The EP2AGX65DF29C6N FPGA has 60,214 logic elements.
The EP2AGX65DF29C6N has 364 I/O pins.
The operating voltage range is 0.87V to 0.93V.
The EP2AGX65DF29C6N is supplied in a 780-FBGA (29x29) package, specifically a 780-BBGA, FCBGA.
The operating temperature range is 0°C to 85°C (TJ).