| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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1,000 pcs
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1000 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
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1 pcs
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1 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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| Number of I/O | |
| Number of LABs | |
| Number of LABs/CLBs | |
| Number of Logic Elements | |
| Number of Logic Elements/Cells | |
| Operating Temperature | |
| Supplier Device Package | |
| Total RAM Bits | |
| Voltage |
The Intel EP2AGX260FF35C6N is a Field Programmable Gate Array (FPGA) designed for embedded applications. It features 244,188 logic elements and 10,260 LABs/CLBs, providing significant processing capabilities.
This FPGA offers 372 I/O pins and 12,038,144 total RAM bits, supporting complex data manipulation and storage. The operating voltage range is 0.87V to 0.93V, with an operating temperature range of 0°C to 85°C (TJ).
The device is packaged in a 1152-FBGA (35x35) format and utilizes a Surface Mount mounting type. The package case is identified as 780-BBGA, FCBGA. This FPGA is suitable for various digital logic and signal processing tasks where reconfigurability is required.
The operating voltage is between 0.87V and 0.93V.
It has 244,188 logic elements.
The EP2AGX260FF35C6N has 372 I/O pins.
The device is supplied in a 780-FBGA (29x29) package.
The operating temperature is from -40°C to 100°C (TJ).
There are 12,038,144 total RAM bits.